Articles about 'Sampling'

Spring Issue 2018

8 May, 2018


Following a previous issue that explored the 10 fundamental truths of process control, this series of Process Watch articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing. By understanding the fundamental nature of process control, fabs can better implement strategies to identify critical defects, find excursions, and reduce sources of variation. These articles touch upon a variety of topics: the ways fabs have found to reduce their environmental impact; the non-intuitive idea that adding process control steps can reduce process cycle time; the cost-effectiveness of detecting and correcting small process excursions; correlating inline metrology/inspection results to EOL yield; and calculating how much inspection data needs to be collected to determine whether or not a new process reduces particle count.

These Process Watch articles were originally published in Solid State Technology.

November 21 2017 Issue

21 November, 2017


This is the introduction to a series of 10 installments which will discuss fundamental truths about process control—inspection and metrology—for the semiconductor industry.
By fundamental, we imply the following:

  • Unassailable: They are self-evident, can be proven from first principles, or are supported by the dominant behavior at fabs worldwide
  • Unchanging: These concepts are equally true today for 28nm as they were 15 years ago for 0.25μm, and are expected to hold true in the future
  • Universal: They are not unique to a specific segment of process control; rather they apply to process control as a group, as well as to each individual component of process control within the fab

Spring Issue 2010

28 April, 2010

SPOTLIGHT: 2010 Lithography Users' Forum

Over 300 technologists, scientists and engineers gathered in San Jose, California on February 21st to attend KLA’s 11th Annual Lithography Users’ Forum. This annual event serves as a sneak peek at more than 20 technical papers co-authored by KLA engineers and customers presented at SPIE’s Advanced Lithography conference. The forum covered current metrology and inspection challenges associated with today’s advanced lithography processes, and KLA’s solutions to those challenges. The event highlight was the keynote, “EUV, EBDW—ArF Replacement or Extension?” presented by Yan Borodovsky, director of the Advanced Lithography Technology, Manufacturing Group at Intel Corp.

Spring Issue 2001

9 April, 2001

Spring 2001 Volume 3, Issue 2

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

Spring Issue 2000

10 April, 2000

Spring 2000 Volume 2, Issue 2

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

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