Advanced Overlay: Sampling and Modeling for Optimized Run-to-Run Control

In recent years overlay control schemes have become more complicated in order to meet the ever shrinking margins of advanced technology nodes. As a result, new challenges must be addressed for effective run-to-run overlay control. Two of these challenges are addressed in this study by new advanced analysis techniques: (1) sampling optimization for run-to-run control; and (2) bias-variance tradeoff in modeling. The sampling and modeling solutions proposed are validated by APC simulations to estimate run-to-run performance, lot-to-lot and wafer-to-wafer model term monitoring to estimate stability, and ultimately high volume manufacturing tests to monitor on-product overlay by densely measured overlay data.

PRODUCT SPOTLIGHT: Overlay and Film Metrology Systems for 5D Patterning Control Solution

KLA is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The Archer 500LCM overlay metrology system offers a wide range of measurement options and supports a range of overlay measurement target designs. The SpectraFilm LD10’s laser-driven plasma light source produces reliable, high-precision film measurements for a broad range of film layers.

PRODUCT SPOTLIGHT: 5D Patterning Control Solution

KLA is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. New systems drive performance throughout the fab ─ WaferSight^TM PWG patterned wafer geometry measurement system, LMS IPRO6 reticle pattern placement metrology system, and K-T Analyzer^® 9.0 advanced data analysis system.

Spotlight: Lithography Users Forum - Keynote Address

Dr. Tatsuhiko Higashiki, Sr. Manager at Toshiba provides the keynote address at this year's Lithography Users Forum on Advanced Lithography.