Articles about 'Computational Lithography'
Spring Issue 2016 19 May, 2016
Advanced Overlay: Sampling and Modeling for Optimized Run-to-Run Control
In recent years overlay control schemes have become more complicated in order to meet the ever shrinking margins of advanced technology nodes. As a result, new challenges must be addressed for effective run-to-run overlay control. Two of these challenges are addressed in this study by new advanced analysis techniques: (1) sampling optimization for run-to-run control; and (2) bias-variance tradeoff in modeling. The sampling and modeling solutions proposed are validated by APC simulations to estimate run-to-run performance, lot-to-lot and wafer-to-wafer model term monitoring to estimate stability, and ultimately high volume manufacturing tests to monitor on-product overlay by densely measured overlay data.
Summer Issue 2015 1 July, 2015
PRODUCT SPOTLIGHT: Overlay and Film Metrology Systems for 5D Patterning Control Solution
KLA is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The Archer 500LCM overlay metrology system offers a wide range of measurement options and supports a range of overlay measurement target designs. The SpectraFilm LD10’s laser-driven plasma light source produces reliable, high-precision film measurements for a broad range of film layers.
Summer Issue 2012 12 June, 2012
Introducing the Surfscan SP3 450
The Surfscan® SP3 450 is the first of KLA’s process control systems capable of handling and inspecting 450mm wafers. As a new configuration of the market-leading Surfscan SP3 platform, these fully-automated unpatterned wafer inspection systems feature unique deep ultra-violet (DUV) sensitivity and unique high-resolution SURFmonitorTM surface quality characterization to support sub-20nm node requirements. The Surfscan SP3 450 enables manufacturing process control for 450mm polished silicon and epitaxial silicon substrates and also delivers critical capability for manufacturers of 450mm process equipment, such as wet clean tools, CMP pads, slurries and polishers, film deposition tools and annealing systems.
Summer Issue 2011 12 July, 2011
SPOTLIGHT: 2011 Lithography Users’ Forum Keynote Presentation
Coinciding with the 2011 SPIE Advanced Lithography exhibition, KLA hosted its one-of-a-kind Lithography Users' Forum (LUF). Annually, this event brings together the industry’s leading lithographers for networking, information sharing, and discussions surrounding challenges facing the industry and possible solutions.
Spring Issue 2010 28 April, 2010
SPOTLIGHT: 2010 Lithography Users' Forum
Over 300 technologists, scientists and engineers gathered in San Jose, California on February 21st to attend KLA’s 11th Annual Lithography Users’ Forum. This annual event serves as a sneak peek at more than 20 technical papers co-authored by KLA engineers and customers presented at SPIE’s Advanced Lithography conference. The forum covered current metrology and inspection challenges associated with today’s advanced lithography processes, and KLA’s solutions to those challenges. The event highlight was the keynote, “EUV, EBDW—ArF Replacement or Extension?” presented by Yan Borodovsky, director of the Advanced Lithography Technology, Manufacturing Group at Intel Corp.
Spring Issue 2006 17 April, 2006
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