Articles about 'Bare wafer Inspection'

Winter Issue 2015

22 January, 2015

WAFER METROLOGY

Addressing Thin Film Thickness Metrology Challenges of 14nm BEOL Layers

This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and simulating the underlayer film information underneath the Cu pad, a single measurement recipe was developed which can be used to monitor each process step in the metal CMP process with stable and reliable results.

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