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Articles about 'Defect Inspection'

November Issue 2017

21 November, 2017

HOTSPOT DISCOVERY AND CONTROL

Hotspot Management: Process Window Discovery and Control

With advanced patterning techniques and shrinking design nodes come the proliferation of hotspots, and complex correlations between hotspots and increasingly narrow process margins. Additionally we see a change in the causes of hotspots; design systematics related to layout or OPC no longer dominate as the primary source of hotspots. We are seeing an increasing effect from process systematics, which are related to design but are induced by process related sources (wafer non-uniformity, process variations), or, in case of multi-patterning schemes, also by interactions between the different masks. These hotspot complexities are driving the need for process window discovery, expansion and control.

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Spring Issue 2000

10 April, 2000 Spring 2000 Volume 2, Issue 2

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Spring Issue 2001

09 April, 2001 Spring 2001 Volume 3, Issue 2

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Spring Issue 2007

02 April, 2007 Spring 2007 Volume 9, Issue 1

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Spring Issue 2010

28 April, 2010

SPOTLIGHT: 2010 Lithography Users' Forum

Over 300 technologists, scientists and engineers gathered in San Jose, California on February 21st to attend KLA-Tencor’s 11th Annual Lithography Users’ Forum. This annual event serves as a sneak peek at more than 20 technical papers co-authored by KLA-Tencor engineers and customers presented at SPIE’s Advanced Lithography conference. The forum covered current metrology and inspection challenges associated with today’s advanced lithography processes, and KLA-Tencor’s solutions to those challenges. The event highlight was the keynote, “EUV, EBDW—ArF Replacement or Extension?” presented by Yan Borodovsky, director of the Advanced Lithography Technology, Manufacturing Group at Intel Corp.

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Spring Issue 2011

01 March, 2011

SPOTLIGHT: LED Manufacturing

LEDs are quickly transforming the lighting industry. High Brightness LED (“HB-LED”) usage is increasing for new applications as manufacturing costs decrease and performance improves. Applications such as mobile phone LCD screens and keypads and flashlights for camera phones have been the drivers for market growth in the last couple of years, as well as car headlights, LCD TV backlights and traffic signaling. HB-LED’s typically are used for high-end applications, making quality control imperative.

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Spring Issue 2013

21 March, 2013

PRODUCT SPOTLIGHT: SensArray

KLA-Tencor's SensArray wafers provide a unique way -- not available through other means -- to monitor the effect of the process environment on semiconductor production wafers. Measurements are used by chipmakers and process equipment manufacturers to optimize and control their processes and process tools.

Process and equipment engineers alike utilize SensArray wafers throughout the fab for thermal information as an indicator of manufacturing equipment performance. With more advanced semiconductor manufacturing technologies -- such as smaller design rules, new materials, and new structures -- temperature control is becoming more critical.

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Summer Issue 2000

10 July, 2000
Summer 2000 Volume 2, Issue 3

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Summer Issue 2003

15 July, 2003 Summer 2003 Volume 5, Issue 2

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Summer Issue 2006

16 August, 2006
Summer 2006 Volume 8, Issue 2

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Summer Issue 2007

09 August, 2007
 Summer 2007: Volume 9, Issue 2

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Summer Issue 2013

30 July, 2013

Spotlight: Lithography Users Forum - Keynote Address

Dr. Tatsuhiko Higashiki, Sr. Manager at Toshiba provides the keynote address at this year's Lithography Users Forum on Advanced Lithography.

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Summer Issue 2014

27 June, 2014

PRODUCT SPOTLIGHT: 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. New systems drive performance throughout the fab ─ WaferSightTM PWG patterned wafer geometry measurement system, LMS IPRO6 reticle pattern placement metrology system, and K-T Analyzer® 9.0 advanced data analysis system.

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Winter Issue 2002

03 December, 2002 Winter 2002 Volume 4, Issue 1

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Winter Issue 2014

09 January, 2014

PRODUCT SPOTLIGHT: Broadband Plasma Defect Inspection

Advanced defect detection, metrology, and review systems are utilized by IC manufacturers to ramp new processes, increase yield and ultimately increase profitability. KLA-Tencor’s unique broadband plasma inspectors offer the most capable technology for discovering all of the yield-critical defect types on leading-edge devices.

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