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Articles about 'Ellipsometry'

Fall Issue 2011

25 October, 2011

SPOTLIGHT: ASMC 2010 Best Paper Award

Each year at the Advanced Semiconductor Manufacturing Conference (ASMC), best paper awards for the conference- one professional, one student - are selected by the technical and steering committee members and presented at the start of the next year's event. This year at ASMC 2011 held in Saratoga Springs, NY, the best professional paper for ASMC 2010, sponsored by Entegris, was awarded to:

Sridhar Ramaswamy, Michael Guse, Michael Linnane, IBM Corporation; Nithin Yathapu, Bill Peterson KLA-Tencor Corporation; Gerhard Lembach GLOBALFOUNDRIES for their paper, "Leveraging Blanket Wafer Film Inspection to Efficiently Characterize Root Cause for Lithographic Micro-Masking Patterning Defects". Congratulations!

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Spring Issue 2003

07 April, 2003 Spring 2003 Volume 5, Issue 1

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

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Summer Issue 2007

09 August, 2007
 Summer 2007: Volume 9, Issue 2

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

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Winter Issue 2015

22 January, 2015

WAFER METROLOGY

Addressing Thin Film Thickness Metrology Challenges of 14nm BEOL Layers

This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and simulating the underlayer film information underneath the Cu pad, a single measurement recipe was developed which can be used to monitor each process step in the metal CMP process with stable and reliable results.

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