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Articles about 'Reticle inspection'

Fall Issue 2005

10 October, 2005
Fall  2005 Volume 7, Issue 2

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Fall Issue 1998

10 August, 1998 Fall Vol1

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Fall Issue 2000

08 September, 2000 Autumn 2000 Volume 3, Issue 1

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Fall Issue 2001

18 September, 2001 Fall 2001 Volume 3, Issue 3

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Spring Issue 2001

09 April, 2001 Spring 2001 Volume 3, Issue 2

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Spring Issue 2004

09 April, 2004 Spring 2004 Volume 6,Issue 1

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Spring Issue 2007

02 April, 2007 Spring 2007 Volume 9, Issue 1

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Spring Issue 2010

28 April, 2010

SPOTLIGHT: 2010 Lithography Users' Forum

Over 300 technologists, scientists and engineers gathered in San Jose, California on February 21st to attend KLA-Tencor’s 11th Annual Lithography Users’ Forum. This annual event serves as a sneak peek at more than 20 technical papers co-authored by KLA-Tencor engineers and customers presented at SPIE’s Advanced Lithography conference. The forum covered current metrology and inspection challenges associated with today’s advanced lithography processes, and KLA-Tencor’s solutions to those challenges. The event highlight was the keynote, “EUV, EBDW—ArF Replacement or Extension?” presented by Yan Borodovsky, director of the Advanced Lithography Technology, Manufacturing Group at Intel Corp.

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Spring Issue 2013

21 March, 2013

PRODUCT SPOTLIGHT: SensArray

KLA-Tencor's SensArray wafers provide a unique way -- not available through other means -- to monitor the effect of the process environment on semiconductor production wafers. Measurements are used by chipmakers and process equipment manufacturers to optimize and control their processes and process tools.

Process and equipment engineers alike utilize SensArray wafers throughout the fab for thermal information as an indicator of manufacturing equipment performance. With more advanced semiconductor manufacturing technologies -- such as smaller design rules, new materials, and new structures -- temperature control is becoming more critical.

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Summer Issue 1998

09 July, 1998
Summer 1998 Volume 1, Issue 1

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Summer Issue 2002

09 July, 2002 Summer 2002 Volume 4, Issue 2

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Summer Issue 2003

15 July, 2003 Summer 2003 Volume 5, Issue 2

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Summer Issue 2007

09 August, 2007
 Summer 2007: Volume 9, Issue 2

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Summer Issue 2012

12 June, 2012

Introducing the Surfscan SP3 450

The Surfscan® SP3 450 is the first of KLA-Tencor’s process control systems capable of handling and inspecting 450mm wafers. As a new configuration of the market-leading Surfscan SP3 platform, these fully-automated unpatterned wafer inspection systems feature unique deep ultra-violet (DUV) sensitivity and unique high-resolution SURFmonitorTM surface quality characterization to support sub-20nm node requirements. The Surfscan SP3 450 enables manufacturing process control for 450mm polished silicon and epitaxial silicon substrates and also delivers critical capability for manufacturers of 450mm process equipment, such as wet clean tools, CMP pads, slurries and polishers, film deposition tools and annealing systems.

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Winter Issue 2005

09 December, 2005
Winter 2005 Volume 7, Issue 1

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