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Articles about 'Mask Registration'

Spring Issue 2016

19 May, 2016

Advanced Overlay: Sampling and Modeling for Optimized Run-to-Run Control

In recent years overlay control schemes have become more complicated in order to meet the ever shrinking margins of advanced technology nodes. As a result, new challenges must be addressed for effective run-to-run overlay control. Two of these challenges are addressed in this study by new advanced analysis techniques: (1) sampling optimization for run-to-run control; and (2) bias-variance tradeoff in modeling. The sampling and modeling solutions proposed are validated by APC simulations to estimate run-to-run performance, lot-to-lot and wafer-to-wafer model term monitoring to estimate stability, and ultimately high volume manufacturing tests to monitor on-product overlay by densely measured overlay data.

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Summer Issue 2014

27 June, 2014

PRODUCT SPOTLIGHT: 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. New systems drive performance throughout the fab ─ WaferSightTM PWG patterned wafer geometry measurement system, LMS IPRO6 reticle pattern placement metrology system, and K-T Analyzer® 9.0 advanced data analysis system.

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Winter Issue 2014

09 January, 2014

PRODUCT SPOTLIGHT: Broadband Plasma Defect Inspection

Advanced defect detection, metrology, and review systems are utilized by IC manufacturers to ramp new processes, increase yield and ultimately increase profitability. KLA-Tencor’s unique broadband plasma inspectors offer the most capable technology for discovering all of the yield-critical defect types on leading-edge devices.

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Winter Issue 2015

22 January, 2015

WAFER METROLOGY

Addressing Thin Film Thickness Metrology Challenges of 14nm BEOL Layers

This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and simulating the underlayer film information underneath the Cu pad, a single measurement recipe was developed which can be used to monitor each process step in the metal CMP process with stable and reliable results.

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