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Articles about 'Process Control'

November 21 2017 Issue

21 November, 2017
Process Control - YMS MagazineProcess Control - YMS Magazine

FUNDAMENTALS OF PROCESS CONTROL

This is the introduction to a series of 10 installments which will discuss fundamental truths about process control—inspection and metrology—for the semiconductor industry.
By fundamental, we imply the following:

  • Unassailable: They are self-evident, can be proven from first principles, or are supported by the dominant behavior at fabs worldwide
  • Unchanging: These concepts are equally true today for 28nm as they were 15 years ago for 0.25μm, and are expected to hold true in the future
  • Universal: They are not unique to a specific segment of process control; rather they apply to process control as a group, as well as to each individual component of process control within the fab
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Spring Issue 2001

09 April, 2001 Spring 2001 Volume 3, Issue 2

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Spring Issue 2011

01 March, 2011

SPOTLIGHT: LED Manufacturing

LEDs are quickly transforming the lighting industry. High Brightness LED (“HB-LED”) usage is increasing for new applications as manufacturing costs decrease and performance improves. Applications such as mobile phone LCD screens and keypads and flashlights for camera phones have been the drivers for market growth in the last couple of years, as well as car headlights, LCD TV backlights and traffic signaling. HB-LED’s typically are used for high-end applications, making quality control imperative.

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Spring Issue 2018

08 May, 2018
Process Control - YMS MagazineProcess Control - YMS Magazine

ADVANCED TOPICS IN PROCESS CONTROL

Following a previous issue that explored the 10 fundamental truths of process control, this series of Process Watch articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing. By understanding the fundamental nature of process control, fabs can better implement strategies to identify critical defects, find excursions, and reduce sources of variation. These articles touch upon a variety of topics: the ways fabs have found to reduce their environmental impact; the non-intuitive idea that adding process control steps can reduce process cycle time; the cost-effectiveness of detecting and correcting small process excursions; correlating inline metrology/inspection results to EOL yield; and calculating how much inspection data needs to be collected to determine whether or not a new process reduces particle count.

These Process Watch articles were originally published in Solid State Technology.

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Summer Issue 2000

10 July, 2000
Summer 2000 Volume 2, Issue 3

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Summer Issue 2002

09 July, 2002 Summer 2002 Volume 4, Issue 2

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

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Summer Issue 2004

09 August, 2004 Summer 2004 Volume 6, Issue 2

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Summer Issue 2011

12 July, 2011

SPOTLIGHT: 2011 Lithography Users’ Forum Keynote Presentation

Coinciding with the 2011 SPIE Advanced Lithography exhibition, KLA-Tencor hosted its one-of-a-kind Lithography Users' Forum (LUF). Annually, this event brings together the industry’s leading lithographers for networking, information sharing, and discussions surrounding challenges facing the industry and possible solutions.

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hideme

Summer Issue 2015

01 July, 2015

PRODUCT SPOTLIGHT: Overlay and Film Metrology Systems for 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The Archer 500LCM overlay metrology system offers a wide range of measurement options and supports a range of overlay measurement target designs. The SpectraFilm LD10’s laser-driven plasma light source produces reliable, high-precision film measurements for a broad range of film layers.

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