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Articles about 'APC'

July Issue 2017

01 July, 2017

ADVANCED PATTERNING CONTROL

Patterning Trends for Advanced IC Manufacturing

With the move to sub-10nm design nodes, the utilization of multi-patterning techniques has intensified, with triple patterning (LELELE), self-aligned quadruple patterning (SAQP), and other complex patterning technologies being utilized to achieve smaller design nodes. IC manufacturers face many technical challenges when implementing advanced multi-patterning, including: the proliferation of process and design systematic defects; extremely tight patterning specifications; and, the erosion of process margins. In this environment, it has become necessary for IC manufacturers to: (1) utilize comprehensive strategies to find and control process and patterning variations at the source.

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Spring Issue 2006

17 April, 2006
Spring 2006 Volume 8, Issue 1

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

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Summer Issue 2006

16 August, 2006
Summer 2006 Volume 8, Issue 2

Preview the interactive digital publishing of YMS Magazine to simulate the experience of reading a print publication online.

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hideme

Summer Issue 2015

01 July, 2015

PRODUCT SPOTLIGHT: Overlay and Film Metrology Systems for 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The Archer 500LCM overlay metrology system offers a wide range of measurement options and supports a range of overlay measurement target designs. The SpectraFilm LD10’s laser-driven plasma light source produces reliable, high-precision film measurements for a broad range of film layers.

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