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Articles about 'Films'

Fall Issue 1998

10 August, 1998 Fall Vol1

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Fall Issue 2011

25 October, 2011

SPOTLIGHT: ASMC 2010 Best Paper Award

Each year at the Advanced Semiconductor Manufacturing Conference (ASMC), best paper awards for the conference- one professional, one student - are selected by the technical and steering committee members and presented at the start of the next year's event. This year at ASMC 2011 held in Saratoga Springs, NY, the best professional paper for ASMC 2010, sponsored by Entegris, was awarded to:

Sridhar Ramaswamy, Michael Guse, Michael Linnane, IBM Corporation; Nithin Yathapu, Bill Peterson KLA-Tencor Corporation; Gerhard Lembach GLOBALFOUNDRIES for their paper, "Leveraging Blanket Wafer Film Inspection to Efficiently Characterize Root Cause for Lithographic Micro-Masking Patterning Defects". Congratulations!

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July Issue 2017

01 July, 2017

ADVANCED PATTERNING CONTROL

Patterning Trends for Advanced IC Manufacturing

With the move to sub-10nm design nodes, the utilization of multi-patterning techniques has intensified, with triple patterning (LELELE), self-aligned quadruple patterning (SAQP), and other complex patterning technologies being utilized to achieve smaller design nodes. IC manufacturers face many technical challenges when implementing advanced multi-patterning, including: the proliferation of process and design systematic defects; extremely tight patterning specifications; and, the erosion of process margins. In this environment, it has become necessary for IC manufacturers to: (1) utilize comprehensive strategies to find and control process and patterning variations at the source.

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Spring Issue 1999

09 April, 1999 Spring 1999 Volume 1, Issue 3

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Spring Issue 2000

10 April, 2000 Spring 2000 Volume 2, Issue 2

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Spring Issue 2003

07 April, 2003 Spring 2003 Volume 5, Issue 1

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Spring Issue 2004

09 April, 2004 Spring 2004 Volume 6,Issue 1

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Spring Issue 2016

19 May, 2016

Advanced Overlay: Sampling and Modeling for Optimized Run-to-Run Control

In recent years overlay control schemes have become more complicated in order to meet the ever shrinking margins of advanced technology nodes. As a result, new challenges must be addressed for effective run-to-run overlay control. Two of these challenges are addressed in this study by new advanced analysis techniques: (1) sampling optimization for run-to-run control; and (2) bias-variance tradeoff in modeling. The sampling and modeling solutions proposed are validated by APC simulations to estimate run-to-run performance, lot-to-lot and wafer-to-wafer model term monitoring to estimate stability, and ultimately high volume manufacturing tests to monitor on-product overlay by densely measured overlay data.

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Summer Issue 2004

09 August, 2004 Summer 2004 Volume 6, Issue 2

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Summer Issue 2007

09 August, 2007
 Summer 2007: Volume 9, Issue 2

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Winter Issue 2005

09 December, 2005
Winter 2005 Volume 7, Issue 1

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Winter Issue 2015

22 January, 2015

WAFER METROLOGY

Addressing Thin Film Thickness Metrology Challenges of 14nm BEOL Layers

This paper describes a method to effectively monitor the film stack at different metal CMP process steps using a spectroscopic ellipsometer metrology tool. By proper modeling of the Cu dispersion and simulating the underlayer film information underneath the Cu pad, a single measurement recipe was developed which can be used to monitor each process step in the metal CMP process with stable and reliable results.

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