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Articles about 'OCD'

Current Issue

01 July, 2017

ADVANCED PATTERNING CONTROL

Patterning Trends for Advanced IC Manufacturing

With the move to sub-10nm design nodes, the utilization of multi-patterning techniques has intensified, with triple patterning (LELELE), self-aligned quadruple patterning (SAQP), and other complex patterning technologies being utilized to achieve smaller design nodes. IC manufacturers face many technical challenges when implementing advanced multi-patterning, including: the proliferation of process and design systematic defects; extremely tight patterning specifications; and, the erosion of process margins. In this environment, it has become necessary for IC manufacturers to: (1) utilize comprehensive strategies to find and control process and patterning variations at the source.

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Fall Issue 2001

18 September, 2001 Fall 2001 Volume 3, Issue 3

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Spring Issue 2006

17 April, 2006
Spring 2006 Volume 8, Issue 1

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Spring Issue 2013

21 March, 2013

PRODUCT SPOTLIGHT: SensArray

KLA-Tencor's SensArray wafers provide a unique way -- not available through other means -- to monitor the effect of the process environment on semiconductor production wafers. Measurements are used by chipmakers and process equipment manufacturers to optimize and control their processes and process tools.

Process and equipment engineers alike utilize SensArray wafers throughout the fab for thermal information as an indicator of manufacturing equipment performance. With more advanced semiconductor manufacturing technologies -- such as smaller design rules, new materials, and new structures -- temperature control is becoming more critical.

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Spring Issue 2016

19 May, 2016

Advanced Overlay: Sampling and Modeling for Optimized Run-to-Run Control

In recent years overlay control schemes have become more complicated in order to meet the ever shrinking margins of advanced technology nodes. As a result, new challenges must be addressed for effective run-to-run overlay control. Two of these challenges are addressed in this study by new advanced analysis techniques: (1) sampling optimization for run-to-run control; and (2) bias-variance tradeoff in modeling. The sampling and modeling solutions proposed are validated by APC simulations to estimate run-to-run performance, lot-to-lot and wafer-to-wafer model term monitoring to estimate stability, and ultimately high volume manufacturing tests to monitor on-product overlay by densely measured overlay data.

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Summer Issue 2002

09 July, 2002 Summer 2002 Volume 4, Issue 2

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Summer Issue 2003

15 July, 2003 Summer 2003 Volume 5, Issue 2

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Summer Issue 2004

09 August, 2004 Summer 2004 Volume 6, Issue 2

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Summer Issue 2006

16 August, 2006
Summer 2006 Volume 8, Issue 2

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Summer Issue 2008

04 August, 2008 Summer 2008 Volume 1

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Summer Issue 2010

23 August, 2010

SPOTLIGHT: ASMC 2010

The 21st annual IEEE/SEMI Advanced Semiconductor Manufacturing Conference (ASMC 2010) was held July 11-13 at the San Francisco Marriott Marquis, in conjunction with this year’s SEMICON West and Intersolar North America conferences. The conference began with an interactive poster session and reception sponsored by KLA-Tencor on Sunday, July 11. 21 papers were featured, authored by engineers from companies and universities from around the world. The rest of this year’s ASMC, held over July 12-13, consisted of 11 additional sessions presenting 49 technical papers, as well as three keynote speeches. The three keynotes, by Matt Nowak, Senior Director of Engineering, VLSI Technology Group, CDMA Technology Division, Qualcomm; Kalin Kuhn, Intel Fellow, Advanced Devices Technology, Intel Corporation; and Bill McClean, President, IC Insights. KLA-TENCOR partnered with IBM, GLOBALFOUNDRIES, imec and Timbre Technologies to present 10 technical papers at the conference.

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Summer Issue 2011

12 July, 2011

SPOTLIGHT: 2011 Lithography Users’ Forum Keynote Presentation

Coinciding with the 2011 SPIE Advanced Lithography exhibition, KLA-Tencor hosted its one-of-a-kind Lithography Users' Forum (LUF). Annually, this event brings together the industry’s leading lithographers for networking, information sharing, and discussions surrounding challenges facing the industry and possible solutions.

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Summer Issue 2012

12 June, 2012

Introducing the Surfscan SP3 450

The Surfscan® SP3 450 is the first of KLA-Tencor’s process control systems capable of handling and inspecting 450mm wafers. As a new configuration of the market-leading Surfscan SP3 platform, these fully-automated unpatterned wafer inspection systems feature unique deep ultra-violet (DUV) sensitivity and unique high-resolution SURFmonitorTM surface quality characterization to support sub-20nm node requirements. The Surfscan SP3 450 enables manufacturing process control for 450mm polished silicon and epitaxial silicon substrates and also delivers critical capability for manufacturers of 450mm process equipment, such as wet clean tools, CMP pads, slurries and polishers, film deposition tools and annealing systems.

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Summer Issue 2013

30 July, 2013

Spotlight: Lithography Users Forum - Keynote Address

Dr. Tatsuhiko Higashiki, Sr. Manager at Toshiba provides the keynote address at this year's Lithography Users Forum on Advanced Lithography.

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Summer Issue 2014

27 June, 2014

PRODUCT SPOTLIGHT: 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. New systems drive performance throughout the fab ─ WaferSightTM PWG patterned wafer geometry measurement system, LMS IPRO6 reticle pattern placement metrology system, and K-T Analyzer® 9.0 advanced data analysis system.

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Summer Issue 2015

01 July, 2015

PRODUCT SPOTLIGHT: Overlay and Film Metrology Systems for 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The Archer 500LCM overlay metrology system offers a wide range of measurement options and supports a range of overlay measurement target designs. The SpectraFilm LD10’s laser-driven plasma light source produces reliable, high-precision film measurements for a broad range of film layers.

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Winter Issue 2005

09 December, 2005
Winter 2005 Volume 7, Issue 1

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