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Articles about 'Overlay'

Fall Issue 2005

10 October, 2005
Fall  2005 Volume 7, Issue 2

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Current Issue

02 November, 2017

HOTSPOT DISCOVERY AND CONTROL

Hotspot Management: Process Window Discovery and Control

With advanced patterning techniques and shrinking design nodes come the proliferation of hotspots, and complex correlations between hotspots and increasingly narrow process margins. Additionally we see a change in the causes of hotspots; design systematics related to layout or OPC no longer dominate as the primary source of hotspots. We are seeing an increasing effect from process systematics, which are related to design but are induced by process related sources (wafer non-uniformity, process variations), or, in case of multi-patterning schemes, also by interactions between the different masks. These hotspot complexities are driving the need for process window discovery, expansion and control.

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Fall Issue 1999

09 August, 1999 Autumn 1999 Volume 2, Issue 2

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Fall Issue 2001

18 September, 2001 Fall 2001 Volume 3, Issue 3

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July Issue 2017

01 July, 2017

ADVANCED PATTERNING CONTROL

Patterning Trends for Advanced IC Manufacturing

With the move to sub-10nm design nodes, the utilization of multi-patterning techniques has intensified, with triple patterning (LELELE), self-aligned quadruple patterning (SAQP), and other complex patterning technologies being utilized to achieve smaller design nodes. IC manufacturers face many technical challenges when implementing advanced multi-patterning, including: the proliferation of process and design systematic defects; extremely tight patterning specifications; and, the erosion of process margins. In this environment, it has become necessary for IC manufacturers to: (1) utilize comprehensive strategies to find and control process and patterning variations at the source.

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Spring Issue 2004

09 April, 2004 Spring 2004 Volume 6,Issue 1

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Spring Issue 2006

17 April, 2006
Spring 2006 Volume 8, Issue 1

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Spring Issue 2010

28 April, 2010

SPOTLIGHT: 2010 Lithography Users' Forum

Over 300 technologists, scientists and engineers gathered in San Jose, California on February 21st to attend KLA-Tencor’s 11th Annual Lithography Users’ Forum. This annual event serves as a sneak peek at more than 20 technical papers co-authored by KLA-Tencor engineers and customers presented at SPIE’s Advanced Lithography conference. The forum covered current metrology and inspection challenges associated with today’s advanced lithography processes, and KLA-Tencor’s solutions to those challenges. The event highlight was the keynote, “EUV, EBDW—ArF Replacement or Extension?” presented by Yan Borodovsky, director of the Advanced Lithography Technology, Manufacturing Group at Intel Corp.

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Spring Issue 2016

19 May, 2016

Advanced Overlay: Sampling and Modeling for Optimized Run-to-Run Control

In recent years overlay control schemes have become more complicated in order to meet the ever shrinking margins of advanced technology nodes. As a result, new challenges must be addressed for effective run-to-run overlay control. Two of these challenges are addressed in this study by new advanced analysis techniques: (1) sampling optimization for run-to-run control; and (2) bias-variance tradeoff in modeling. The sampling and modeling solutions proposed are validated by APC simulations to estimate run-to-run performance, lot-to-lot and wafer-to-wafer model term monitoring to estimate stability, and ultimately high volume manufacturing tests to monitor on-product overlay by densely measured overlay data.

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Summer Issue 2000

10 July, 2000
Summer 2000 Volume 2, Issue 3

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Summer Issue 2002

09 July, 2002 Summer 2002 Volume 4, Issue 2

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Summer Issue 2003

15 July, 2003 Summer 2003 Volume 5, Issue 2

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Summer Issue 2011

12 July, 2011

SPOTLIGHT: 2011 Lithography Users’ Forum Keynote Presentation

Coinciding with the 2011 SPIE Advanced Lithography exhibition, KLA-Tencor hosted its one-of-a-kind Lithography Users' Forum (LUF). Annually, this event brings together the industry’s leading lithographers for networking, information sharing, and discussions surrounding challenges facing the industry and possible solutions.

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Summer Issue 2012

12 June, 2012

Introducing the Surfscan SP3 450

The Surfscan® SP3 450 is the first of KLA-Tencor’s process control systems capable of handling and inspecting 450mm wafers. As a new configuration of the market-leading Surfscan SP3 platform, these fully-automated unpatterned wafer inspection systems feature unique deep ultra-violet (DUV) sensitivity and unique high-resolution SURFmonitorTM surface quality characterization to support sub-20nm node requirements. The Surfscan SP3 450 enables manufacturing process control for 450mm polished silicon and epitaxial silicon substrates and also delivers critical capability for manufacturers of 450mm process equipment, such as wet clean tools, CMP pads, slurries and polishers, film deposition tools and annealing systems.

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Summer Issue 2014

27 June, 2014

PRODUCT SPOTLIGHT: 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. New systems drive performance throughout the fab ─ WaferSightTM PWG patterned wafer geometry measurement system, LMS IPRO6 reticle pattern placement metrology system, and K-T Analyzer® 9.0 advanced data analysis system.

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Summer Issue 2015

01 July, 2015

PRODUCT SPOTLIGHT: Overlay and Film Metrology Systems for 5D Patterning Control Solution

KLA-Tencor is driving improved patterning by addressing five elements of patterning control ─ the three geometrical dimensions of device structures, time-to-results and overall equipment efficiency. The Archer 500LCM overlay metrology system offers a wide range of measurement options and supports a range of overlay measurement target designs. The SpectraFilm LD10’s laser-driven plasma light source produces reliable, high-precision film measurements for a broad range of film layers.

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Winter Issue 2005

09 December, 2005
Winter 2005 Volume 7, Issue 1

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