Product Spotlight: SensArray

KLA-Tencor's SensArray wafers provide a unique way -- not available through other means -- to monitor the effect of the process environment on semiconductor production wafers. Measurements are used by chipmakers and process equipment manufacturers to optimize and control their processes and process tools.

Process and equipment engineers alike utilize SensArray wafers throughout the fab for thermal information as an indicator of manufacturing equipment performance. With more advanced semiconductor manufacturing technologies -- such as smaller design rules, new materials, and new structures -- temperature control is becoming more critical.


Defect Inspection Challenges and Solutions for Ultra-Thin SOI

The challenges and solutions for ultra-thin SOI inspection using a laser light scattering based system are explored, including a detailed investigation of the impact of reflectivity on haze, sizing and minimum threshold. This paper shows how the required sensitivity for 28nm and beyond SOI inspection was achieved using a commercially available unpatterned DUV inspection system.

  • Development of CMP Pad Using an Unpatterned Surface Inspection System.
  • Photo Cell Monitoring Inspection Methodology Employing a Complementary Strategy of Advanced Darkfield and High Sensitivity Brightfield Inspection Tools.
  • Use of 22 nm Litho SEM Non-visual Defect Data as a Process Quality Indicator.
  • Reflective Electron-Beam Lithography Performance for the 10 nm Logic Node.
  • Scatterometry Measurement for SiGe AEI Sigma-Shaped Gate Structures of 28nm Technology.

    Photomask Film Degradation Effects in the Wafer Fab – How To Detect And Monitor Over Time

    As a result of repeated cleanings and exposure effects such as chrome migration or MoSi oxidation some photomasks in the semiconductor fabs exhibit changes in critical dimension uniformity (CDU) over time. Detecting these effects in a timely manner allows for better risk management and process control in manufacturing.