CURRENT ISSUE - ASMC 2011

ASMC 2010 Best Paper Winner

Each year at the Advanced Semiconductor Manufacturing Conference (ASMC), best paper awards for the conference- one professional, one student - are selected by the technical and steering committee members and presented at the start of the next year's event. This year at ASMC 2011 held in Saratoga Springs, NY, the best professional paper for ASMC 2010, sponsored by Entegris, was awarded to:

Sridhar Ramaswamy, Michael Guse, Michael Linnane, IBM Corporation; Nithin Yathapu, Bill Peterson KLA-Tencor Corporation; Gerhard Lembach GLOBALFOUNDRIES for their paper, "Leveraging Blanket Wafer Film Inspection to Efficiently Characterize Root Cause for Lithographic Micro-Masking Patterning Defects". Congratulations!

  • Automated SEM Offset Using Programmed Defects

    Optical defect inspection plays a large role in the development and manufacture of semiconductor technologies. Tens of optical inspections are strategically...

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Inline Control of an Ultra Low-k ILD layer using Broadband Spectroscopic Ellipsometry

Semiconductor manufacturers are driven to an aggressive roadmap to improve device performance in order to remain competitive and provide technology that enables complex computations...

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  Automated Systematic Discovery for   Development and Production
 

In many semiconductor Fabs a combination of in-line photo inspection (PLY) and targeted physical failure analysis (PFA) is used to identify and monitor random defectivity, process excursions...

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  • Advanced Excursion Control and Diagnostics for CMP Process Monitoring

    This paper will discuss excursion control methodologies adopted at IBM using Puma 9550 DF wafer inspection system with Inline Defect Organizer for automatically...

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Proceedings first published at ASMC 2011 Conference.

 

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